Issue link: https://iconnect007.uberflip.com/i/1460418
MARCH 2022 I PCB007 MAGAZINE 45 tilayer and HDI going up, we modified the replacement process to create a new paradigm in array design. When the costs indicate that the array layout creates a lot of wasted mate- rial, we have the CAM department lay out a multi-image panel for production. Aer test and inspection, the good boards are placed in an array made to the array specifications from a routed bare FR-4 material. e advantages of this process are: Figure 4: Individual finished board repanelization in a simple piece of laminate. Figure 3: Process flow for array repanelization. 1. Single module and break-aways can be individually produced. 2. Increases the production panel material utilization or plating distribution. 3. Improves the dimensional stability. 4. Reduces environmental pollution and scrap caused by discarded boards. e process is seen in Figures 3 and 4. Interestingly, some customers now prefer