PCB007 Magazine

72 PCB007 MAGAZINE I NOVEMBER 2022 Figure 11: 3D structures with cavities and embedded components. Figure 12: Complete 3D design with AME, with no layers or interconnect structures. Figure 13: Existing ECAD and MCAD systems have no or limited connection between them.

• PCB007 Magazine — November 2022
• Featured Content — An Eye on UHDI
• Additional Content
• Column — UHDI: Raising Awareness and Interesting Questions
• Feature Interview — Understanding the UHDI Market
• Column — Rallying Around a Robust Ecosystem
• Short — Discovery of New Nanowire Assembly Process Could Enable More Powerful Computer Chips
• Feature Interview — The Growing Need for UHDI
• Feature Interview — Candor: UHDI Under Development
• Column — Decision Time: Invest or Delegate?
• Short — Advanced Packaging Symposium Special Coverage
• Column — Cupric Chloride Regeneration Options
• Feature Interview — The UHDI Spectrum
• Infographic: Anatomy of Ultra HDI
• MilAero007 Highlights
• Interview — MKS Discusses the Cutting Edge of Technology
• Feature Article — 3D Electronic Devices With Additive Manufacturing
• Short — A Cleaner, Better Way to produce Single-photon Emitters
• Column — A Day in the Life of a Process Engineer
• Interview — ICAPE: Staying on Top During 'Interesting' Times
• Column — Palladium as a Final Finish
• Column — Congress Must Redefine What's Critical
• Short — A Vision for Navigating When GPS Goes Dark
• Top Ten Editor's Picks
• Career Opportunities section
• Educational Resources
• Advertiser Index and Masthead
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