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NOVEMBER 2022 I PCB007 MAGAZINE 71 The Second Cornerstone for 3D AME: 3D Design Tools How can you design 3D electronic devices? Today, ECAD and MCAD are two parallel pro- cesses, oen with limited or no integration between them. Current ECAD design systems need to have critical new 3D capabilities to enable smooth 3D designs. Future CAD systems need to have common/ integrated ECAD and MCAD capabilities for 3D electro-mechanical CAD design (3D AME capabilities). ey should be able to deliver accurate 3D AME simulation of 3D electronic structures. Components such as 3DT, printed coils, capacitors, and other 3D electronics need to be part of the 3D electronic simulation. 3D Industry Initiatives ere are several initiatives in the industry, including two developments by Cadence/Das- sault Systems and by Siemens EDA. ere are other CAD systems vendors that are work- ing on bringing the 3D editing capabilities for AME, but it may take some time to for this to develop. erefore, Nano Dimension has intro- duced its own soware suite, FLIGHT, which enables 3D AME design capabilities through the integration of ECAD and MCAD systems. Figures 9 and 10: Superior high-frequency performance of 3D AME with coax vs. traditional vias.