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70 PCB007 MAGAZINE I NOVEMBER 2022 3DT high-frequency properties show tre- mendous advantages over drilled/via-based routed PCB designs. We compared the RF per- formance of traditional via structure vs. a 3DT structure. We received significantly better S11 and S21 performance with AME 3DT configuration (Figure 8). We took it to the next stage, and we con- verted the 3DT to an AME coax, which can be built as part of the structure printing process instead of the via in traditional PCB process. As a result, the high-frequency performance was much better than traditional via performance. 3D Electronic Devices Enabled by AME 3D AME enables designers to build differ- ent form factors for electronic devices and to fit them to the required mechanical device in a more appropriate way. It also enables one print process of complex, 3D structures where conventional PCB pro- duction requires many stages and might even be impossible. is example is taking 3D AME to new lev- els of complete 3D devices with better perfor- mance, embedded components and shield- ing. It created a new form factor with stronger mechanical properties. Figure 7: Comparison illustrating the conversion of a traditional via connection to 3DT. Figure 8: PCB with 4 GND via vs. AME 3DT diagonal trace implementation leads to better S11 and S21, input reflection and forward transmission.