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98 PCB007 MAGAZINE I NOVEMBER 2022 For the past two years, EIPC's Tech- nical Snapshot series has kept us extremely well- informed on devel- opments in printed circuit materials and manufacturing tech- nologies. But what is currently happen- ing in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? Success in the plating room rests largely on the understanding of and the application of those critical principles that govern the process of electrodeposition. This month, I look at the fundamentals of plating distribu- tion and throwing power, and what that means for the circuit board fabricator. Computer science has become the new "cool." Today's students were groomed to want jobs in tech at big companies with happy hours, big paychecks, and high status. Let's face it, manufacturing just isn't sexy. It's dirty, manual, and for electronics, has a history of low margins. The pipeline into the field is broken. But it doesn't have to stay that way. Paige Fiet lays out the problem behind the board. IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs There is a significant capability gap in advanced substrate packaging in North America, forcing all semiconductors to be packaged in Asia and leaving North America at risk in its supply chain. Trouble in Your Tank: Electro- deposition of Copper, Part 3— Plating Distribution and Throwing EIPC Technical Snapshot: 'Tremendous Uncertainty' in Global PCB Marketplace The New Chapter: Let's Make Manufacturing 'Cool' Again Pete Starkey TOP TEN EDITOR'S PICKS

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