Issue link: https://iconnect007.uberflip.com/i/1484263
66 PCB007 MAGAZINE I NOVEMBER 2022 tainly is doable, but it does not achieve the full potential and capabilities of 3D AME. Let's review the following three examples: 1. In PCB traditional processes, the more layers required, the more complex and expensive the PCB, and the longer the lead time. In AME, there is no additional cost to add layers; in fact, there is no limitation on the number of layers. e real question is, "Do we need to continue to work in finite layer structures?" 2. PTH is a lengthy and high-cost process that requires drilling, plating, etching, and waste treatment. It is sensitive to registra- tion between layers, and as we increase the layer count, layer registration becomes more difficult. In AME, there are almost no registration issues. e entire process is done by one tool with one printing pro- cess. e results are near-perfect registra- tion with negligible registration error, and with mechanical repeatability of the same tool. If we do not require the insertions of pins in the PTH, AME can re-create elec- tronic parts at the same cost and time with stacked filled VIPPO (via-in-pad plated over), and/or staggered. 3. Microvia manufacturing is the most expensive process. It is composed of laser drilling combined with via plating, clean- ing, and in many cases even via conduc- tive-resin filling. In AME, there is no extra cost of building conductive filled vias. Actually, the AME process builds pillars between layers that represent the via con- nection. is is all achieved during the same printing process, with no need to change tools to do drilling. Registration is close to perfect. Traditional Drilling and Plating: The Most Expensive Processes e combination of layer registration, drill- ing, and plating processes can lead to dramatic yield reduction during PCB manufacturing. ese processes are complicated and represent the highest CapEx investment in annual PCB CapEx spend. e industry average CapEx of drilling and plating represents over 32% of total PCB CapEx. As technology becomes more complex and denser, this ratio is even higher. AME does not require drilling, board lamina- tion, plating, and many other wet processes. Current PCB Traditional VIA Technology vs. AME 3DT Alternative As the amount of drilling increases (mechani- cal or laser), the higher the cost and the longer the lead time is required to complete the PCB orders. Figure 2: Microsections illustrating how AME can create simple and complex 3D PCB designs.