Issue link: https://iconnect007.uberflip.com/i/1484263
NOVEMBER 2022 I PCB007 MAGAZINE 67 Drilling processes involve many technologi- cal considerations in the level of board design. For example, landing pads/capture pads are required. ose pads are placed to overcome the misalignment and tolerances of the PCB process, but the consequences of adding those pads is that they occupy a significant amount of PCB "real estate." In addition, the via structure is a source of par- asitic impedance mismatching. ey differ in their final geometries, and it is difficult to consis- tently predict their high-frequency performance. Figure 3: PCB equipment spending. (Courtesy of Primark 2021) Figure 4: 3D AME: New capabilities—higher density by replacing vias with ZDT interconnect.