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18 PCB007 MAGAZINE I JANUARY 2023 Over the past year, IPC has stepped up its efforts to educate policymakers and other key audiences on the importance of investing in the entire semiconductor supply chain to achieve the goals of the recently enacted CHIPS and Science Act, including in advanced packaging and printed circuit boards. For example, an IPC report last winter found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have sprinted ahead to develop the lion's share of capabilities and capacity 1 . A more recent report by IPC, based on a survey of nearly 100 industry leaders in semiconductors and related fields, revealed that only 29% think government policymakers understand the importance of advanced pack- aging in driving innovation, and 84% believe government initiatives to bolster the semicon- ductor supply chain require significant invest- ment in advanced packaging capabilities 2 . An IPC-convened symposium on the topic in October in Washington, D.C., was well attended by representatives of the U.S. government and all sectors of the electronics industry 3 . Progress is also being made on the policy- making front, although much work remains to be done. Most notably, the CHIPS Act includes IPC-backed provisions to invest at least $2.5 billion in advanced packaging capabilities in the U.S. in 2023, and we are continuing to advo- cate for that objective as the new law is imple- mented. IPC succeeded in nominating sev- eral advanced packaging experts to a new U.S. government advisory panel on microelectron- An Advanced Packaging Year in Review One World, One Industry Feature Column by Dr. John W. Mitchell, IPC PRESIDENT AND CEO

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