Issue link: https://iconnect007.uberflip.com/i/1490123
64 PCB007 MAGAZINE I JANUARY 2023 The I-Connect007 Editorial Team asked IPC Chief Technol- ogist Matt Kelly: Will you help us understand what advanced packaging means? This infor- mative conversation touched on topics for both assembly and board fabrication. In the January issue of SMT007 Magazine, Matt helps define not only what advanced packaging is, but the approach EMS companies must take when looking ahead. Think it's about just adding some new equip- ment and software? Think again. There are logistics, onboarding, and so much more. Nolan Johnson: Matt, I was on the exhibition floor at a technical conference recently and heard a lot of questions about advanced packaging: What is it, how does it apply, what does it mean to EMS providers, etc.? Would you help to define and provide a frame- work about advanced packaging? Matt Kelly: There are two terms to define. An advanced package is an electronic component; it's as simple as that. It has a few elements—it's com- prised of a semiconductor chip (typi- "right answer" way of thinking. rough prac- tice and time, we can better prepare ourselves for the challenges that lie ahead in both our industry and our personal lives. PCB007 Resources 1. "Build a tower, build a team," by Tom Wujec at TED2010, TED.com, Feb. 2010. Paige Fiet is a process engineer at TTM-Logan. To read past columns, click here. spatial visualization and to see how compo- nents move together to create a whole. ese activities are no more important than a college education; rather, they expand on skills stu- dents have learned in class and help diversify our thinking processes. Schools can and should offer these types of activities but, for now, it is up to students to seek out these opportunities so that they can expand their problem-solving skills. It is essen- tial for engineers to be able to think outside of the box—to test prototype aer prototype until a solution is found. Adults playing the marshmallow game would do well to extend their approach to problem-solving beyond the cally silicon) and an interposer and/or substrate— followed by interconnection and assembly of the component. Advanced packaging is the process by which these elements are integrated, assem- bled, and tested. Advanced packages represent a very specific class of electronic components called active devices. They are called active devices because they contain silicon that provides com- pute, memory, or other logical device functions. Advanced packaging is critical because the com- bination of performance, reliability, cost, and func- tionality that future consumers are demanding can only be met by integrating silicon chips through an advanced packaging process. To read the entire interview in SMT007 maga- zine, click here. The Nuts and Bolts of Advanced Packaging An Interview with Matt Kelly