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86 PCB007 MAGAZINE I JANUARY 2023 Conclusion Improvements in etch factor will drive PCB manufacturing into the future and poten- tially allow U.S. manufacturers to get ahead of the market. Improvements in etch factor may result in a rapid shi towards subtractive- driven manufacturing processes. To achieve such progress, significant investment needs to be made in research on copper etching chem- istry, which will allow us to determine how far etch factor limitations can be pushed. PCB007 Christopher Bonsell is a chemical process engineer at Chemcut. To read past columns or contact Bonsell, click here. the high etch factors necessary to break from SAP, focusing our research efforts into copper etch chemistry might result in revolutionary developments for the industry. To achieve this, we will need to grab the atten- tion of the younger generation (those with a chemistry background, in particular) and bring their attention to this issue. If we can manage to get the next generation and academia invested in copper etch chemistry, we may see a rapid shi in the industry. Even if we discover that etch factors on a scale of 20:1 is impossible, PCB manufacturers still stand to benefit from general improvements in etch factor. Although it would be ideal to achieve fine features without SAP, we can still use SAP to further improve the fea- tures we have. Improving etch factors will open doors to obtaining the fine features necessary for UHDI resolution. by Semiconductor Industry Association Following the historic enactment of the CHIPS and Science Act to reinvigorate domestic semicon- ductor manufacturing and research, the Semicon- ductor Industry Association (SIA) and the Boston Consulting Group (BCG) today released a report finding contin- ued U.S. leadership in semicon- ductor design—the critical and high-value-add mapping of a chip's intricate circuitry—is essen- tial to America's sustained lead- ership in semiconductors and the many technologies they enable. The report, titled "The Grow- ing Challenge of Semiconduc- tor Design Leadership," identifies three key challenges facing the U.S. chip design sector and high- lights opportunities to strengthen America's position as a global semiconductor innovation and workforce leader. The report finds that a federal investment in semi- conductor design and R&D of approximately $20 bil- lion to $30 billion through 2030—including $15 billion to $20 billion for an investment tax credit for semi- conductor design—will help maintain long-term U.S. chip design leadership. Such an investment would fortify the U.S. design ecosystem, support training and employment for more than 150,000 jobs across the economy, and help the U.S. win the global competition for key semiconductor-dependent inno- vations of the future, according to the report. The CHIPS and Science Act—now codified in 15 U.S.C. Ch. 72A § 4651-4659—includes a critical investment tax credit for semiconductor manufacturing, but not for design. The SIA-BCG report also highlights the impor- tance of promoting STEM work- force development and ensuring open access to global markets, among other priorities. New Report Identifies Challenges to Continued U.S. Leadership in Semiconductor Design, Innovation