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22 PCB007 MAGAZINE I JANUARY 2023 Feature Article by Charles Woychik SKYWATER TECHNOLOGY FOUNDRY e future of the semiconductor industry is to disaggregate a large system-on-chip (SoC) device into smaller cells, called chiplets. is is where each cell will utilize the semiconduc- tor node that maximizes its performance. In this scenario, some chiplets will continue to use mature legacy node technologies to ensure optimum performance along with lower cost. Other cells will require finer nodes to achieve performance objectives, which will be more costly. By using this approach, node scaling will continue, but only for cells (or chiplets) that require it. is is a much more cost-effec- tive approach for delivering state-of-the-art semiconductor solutions, referred to as het- erogeneous integration (HI). A benefit of HI packaging is the ability to integrate multiple chiplet functions to achieve enhanced performance as compared to a monolithic SoC. is approach can reduce the time to market and cost but requires a robust and reliable method to package these chiplets. Figure 1 lists the pros and cons for HI. One of the major obstacles to implementing HI is the need to develop an integrated ecosystem for manufacturing, especially a domestic source. HI packaging technology is revolutionizing the world of microelectronics. By combining Heterogeneous Integration Technologies Driving Advanced Packaging Solutions Figure 1: HI using chiplets offers many advantages over conventional SoC, but creating a viable HI ecosystem requires overcoming several challenges.

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