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4 PCB007 MAGAZINE I JANUARY 2023 JANUARY 2023 • FEATURED CONTENT As semiconductor companies seek ways to prolong Moore's Law, new advanced compo- nent packaging techniques and in-package substrates are blurring the boundaries between printed circuit and semiconductor fabrication. Are there strategic opportunities–new direc- tions in which to shift your business–in this new space? In this issue, we open the discus- sion about how advanced packaging will change the structure of our industry. The Advanced Move FEATURE INTERVIEWS Substrate Manufacturing: What Does It Take? with Jan Vardaman Everyone Wants Change: Who Wants to Lead the Way? with Mark Goodwin and Alun Morgan MKS Atotech: Chemically Connecting the Industry with Tobias Helbech FEATURE COLUMNS An Advanced Packaging Year in Review by Dr. John W. Mitchell Advanced Packaging Not Just a Passing Fad by John Watson FEATURE ARTICLES Heterogenous Integration Technologies Driving Advanced Packaging Solutions by Charles Woychik Advanced Packaging Beyond the Zetabyte Era by Tom Rucker The Impact of Chip Packaging by Chuck Bauer 10 66 76 18 28 22 36 54

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