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Gobright ® TWX-42 "RAIG" (Reduction-Assisted Immersion Gold) deposits 6-8 µin gold with zero nickel corrosion. Delivers both immersion and autocatalytic modes of deposition. A proven "next gen" process for achieving heavier gold deposits on ENIG, ENEPIG, EPIG, and EPAG. IPC 4552/4556 compliant. MEC Etchbond CZ 8201 and Organic Flatbond provide microetch and etch-free inner layer bonding and high adhesion performance for HF applications, including those demanding low loss dielectric resins. TPD-21/23 are electroless pure palladium processes for surface mount applications; they are ideally suited to fine patterns and HF applications. Processes are autocatalytic, with excellent wire bonding for PCBs and IC packages. Gold and aluminum wire bondable when top-coated with immersion gold and RAIG. Direct Immersion Gold ("DIG") produces dense non-porous gold up to 0.3 µm, and meets the highest standards for HF and fine pattern capability. Compatible with flex PWBs, provides high solderjoint reliability. Talon 3 Electroless Palladium plates directly onto electroless nickel, copper, and zincated aluminum and is the foundation for ENEPIG, EPIG and EPAG final finish layer deposits. Gold and aluminum wire bondable when top-coated with immersion gold. Talon 3 is highly stable and tolerant of impurities. Corporate Headquarters: 3990 Concourse, #425 • Ontario, CA 91764 • ph: (909) 466-5635 Tech Center: 240 Town Line Road • Southington, CT 06489 • Ph: (860) 793-4011 Global Leader in Final Finish Technology www.uyemura.com Visit us at Booth 509