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IPC COMMUNITY 64 SUMMER 2023 Silicon-to-Systems in Europe I nnovation. Digital and Green Transition. Supply Chain Resiliency. Advanced Pack- ag i ng . S e c u r i t y. Su s ta i n a b i l i t y. Ro b u s t Electronics Ecosystem. These vital themes were explored on April 13 at a meeting in Brussels organized by IPC for electronics industry leaders and European government officials. The primary impetus for the gathering was to celebrate the imminent passing of the European Chips Act, legislation designed to manufacture semiconductors in Europe to secure supply for Europe's indus- tries. However, there was also an active and vibrant discussion on partnering with the gov- ernment to strengthen Europe's overall elec- tronics manufacturing ecosystem by enhanc- ing the region's capabilities and capacities through a "silicon-to-systems" approach. Fifty influential individuals representing 31 companies and three important Director- ate-Generals of the European Commission were treated to forward-looking keynote addresses by Mrs. Eva Maydell, member of the European Parliament, and Dr. Francisco Ibanez, microelectronics subject matter expert at the European Commission. There were two industry panel discussions, one focused on technology and the other focused on the market. Matt Kelly, IPC chief technology officer and VP of technical solutions, moderated a dis- cussion, titled "Building Leadership in Semi- conductor Packaging," with key technologists Jose Silva from Amkor, Hannes Voraberger from AT&S, Chris Scanlan from Besi, and Rolf Aschenbrenner from Fraunhofer. Some of the key points expressed were: • Splitting the system-on-chip into multi- ple, smaller chiplets, and then connect- ing them within the package utilizing advanced chip-to-wafer die attach, is an optimal solution to counter the slowing of Moore's law. • Scaling capabilities and high-speed interconnection can be achieved with advanced IC substrates and packaging. • OSATs can serve as cost-effective building blocks for back-end semiconductor pack- aging and test. • Trends show that the gap between the wafer fab and system level is narrowing. • There is strong commitment to having a Pan-European pilot line facility to support advanced heterogeneous system integra- tion (AHSI). By Sanjay Huprikar, IPC President, Europe and South Asia Operations IPC hosts inaugural meeting in Brussels Mrs. Eva Maydell SOLUTIONS

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