IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1503860
IPC COMMUNITY 99 SUMMER 2023 EU Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) General Review and changes to exemptions and new substances; and the importance of industry data and participation in studies during regulatory consultation periods. Key takeaways included policy themes that reflect our daily work to engage with industry and government colleagues on critical environ- mental requirements for electronics. While it is the responsibility of every com- pany to understand the environmental requirements that apply to them, IPC will con- tinue being your educational resource and advocate. To learn more about IPC's policy and research work in environment, health, and sustainability, please email Suhani Chitalia, IPC's environmental regulatory affairs man- ager, at SuhaniChitalia@ipc.org. IPC and IMAPS Host Onshoring Advanced Packaging and Assembly Workshop IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) hosted an "On-Shoring Advanced Packaging and Assem- bly" workshop July 10–12, 2023, in Washington, D.C. Bringing together government agencies, the Defense Industrial Base (DIB), and advanced packaging and assembly providers, the work- shop focused on efforts to onshore advanced packaging and identify newly created programs to address U.S. government and defense require- ments critical to microelectronics assembly and packaging supply chain. Keynotes included: "CHIPS," by Eric Lin, U.S. Department of Commerce; "DPA/Title III and ICAM/IBAS Activity," by Anthony Di Sta- sio, Office of the Under Secretary of Defense (A&S); "Next Generation Microelectronics Manufacturing (NGMM)," by Carl McCants, Ph.D., DARPA; and "DoD ME Commons," by Dev Shenoy, Ph.D., Office of the Undersecre- tary of Defense and Director of the Defense Microelectronics Cross Functional Team. Our message to policymakers is that build- ing a more robust, domestic ecosystem for advanced electronics will require a few key policy decisions: investment in advanced packaging capacity and research and devel- opment, supply chain partnership promotion, and strategic decisions on what we are build- ing and for whom. This workshop brought the important players to the table—policymakers, the DIB, and commercial suppliers—who have a goal to improve on advanced packaging and assembly onshoring strategies. IPC High Reliability Forum Back and Better Than Ever If you manufacture, design, or test Class 3 electronics for mil-aero, automotive, and long-life applications subjected to harsh use environments, you won't want to miss the IPC High Reliability Forum, Oct. 17–19, 2023, at the Hilton Baltimore BWI Airport Linthicum (Bal- timore), Maryland. Registration is now open. The IPC High Reliability Forum offers a unique opportunity to learn about the latest advance- ments in electronics, participate in industry discussions, and network with this respected community of professionals focused on elec- tronics with high reliability requirements. For more information, click here.