IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1503860
IPC COMMUNITY 66 SUMMER 2023 I moderated a discussion titled, "State of the PCB and EMS Industries," with key executives Thomas Michels from ILFA, Dirk Stans from Eurocircuits, Marc Achhammer from Katek Group, and Xaver Feiner from Zollner. Some of the key points expressed were: • Industry and the government should work together more closely to re-align policies, and to address vulnerabilities in critical technologies like printed circuit board and printed circuit board assembly, by identifying measures that ensure greater resilience. • Having a continuous pipeline of compe- tent and trained workers remains one of the electronics industry's biggest chal- lenges. • Europe is falling behind on incentivizing R&D and capital in back-end segments. One of the truly unique features of this meeting was the incredible attendance and enthusiastic participation across the entire value chain. Different phases were well repre- sented by prominent organizations: • OEMs: Siemens, Continental • Semiconductors: Intel, NXP • OSATs: Amkor, ASE • Equipment: ASML, Besi, Viscom • Research: Fraunhofer, IMEC, CEA-LETI • EMS: Zollner, Katek, C-Mac • PCB/substrate: AT&S, Samsung Electro-Mechanics, Unimicron GmbH, Somacis, Elvia, Dyconex, ILFA, Eurocircuits, Polytron-Print, Cistelaier, Elco, ACB • Electronics materials: CCI Eurolam • Advanced packaging: Novapack Technologies • National nonprofit: Estonian Electronics Industries Association • Intergovernmental organization: European Space Agency • European Commission Directorate- Generals: GROW, DEFIS, CNECT IPC was instrumental in ensuring that the adoption language of the European Chips Act reflects the strategic role of advanced pack- aging in driving innovation and the transition to digital and green. We applaud the dedi- cated work of the European institutions on the Chips Act and the upcoming discussions on broader initiatives and funding opportu- nities to ensure a more competitive, resil- ient, and sustainable electronics industry in Europe. Our meeting was an important step in IPC's strategy to expand a European electron- ics community around a silicon-to-systems approach.