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IPC_Community-Q323

IPC International Community magazine an association member publication

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A P C T L e a d i n g T h e P r i n t e d C i r c u i t B o a r d I n d u s t r y APCT.com | 4PCB.com ONE COMPANY | ONE TEAM • Rigid Through-Hole ~ Up to 40-Layers • Flex Applications ~ Up to 6 Layers • Oversized Boards ~ Up to 37" by 120" • Cavity Board Capability • Buried Resistor Capability Introducing In-House Design ~ HDI, RF, Rigid Flex • HDI; Blind/Buried/Stacked Vias ~ Up to 8x Sequential Laminations • Rigid Flex Applications ~ Book Binder Capability • Heavy Copper ~ Up to 20 oz. • RF Technology Expertise • Heat Sink Bonding Capability Introducing In-House Assembly ~ For NPI & Quick-Turn The Most Extensive Value Proposition In The Industry Design | Fabrication | Assembly

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