Design007 Magazine

Design | Fabrication | Assembly APCT.com | 4PCB.com • Rigid Through-Hole ~ Up to 40-Layers • Flex Applications ~ Up to 6 Layers • Oversized Boards ~ Up to 37" by 120" • Cavity Board Capability • Buried Resistor Capability • Introducing In-House Design ~ HDI, RF, Rigid Flex • HDI; Blind/Buried/Stacked Vias ~ Up to 8x Sequential Laminations • Rigid Flex Applications ~ Book Binder Capability • Heavy Copper ~ Up to 20 oz. • RF Technology Expertise • Heat Sink Bonding Capability • Introducing In-House Assembly ~ For NPI & Quick-Turn

• Design007 Magazine — August 2023
• Feature Contents — Simulation, Analysis, and AI
• Additional Contents
• Column — Simulation, Analysis, and AI
• Short — MIT Engineers Create An Energy-storing Supercapacitor from Ancient Materials
• Feature Column — Integrating AI Into PCB Design Flow
• Short — Researchers Achieve Historic Milestone in Energy Capacity of Supercapacitors
• Feature Interview — How Far Can We Trust AI?
• Feature Interview — PCB Design, Digital Twin, and Digital Transformation
• Feature Article — Three Ways to Improve High-speed PCB Signoff, Part 1
• Short — IPC E-Textiles Committee A-Teams Are Shaping Some Much-needed Standards
• Column — Best Drilling Practices for Better PCB Manufacturing
• Short — BOOK EXCERPT: The Printed Circuit Designer's Guide to… Manufactururing Driven Design
• Feature Article — 3D Electromagnetic Analysis
• Feature Column — Circuit Simulation, SPICE, and AI
• MilAero007 Highlights
• Feature Article — Challenges in Modern PCB Design and Analysis
• Infographic: EDA By the Numbers
• Q&A — Model Citizens: Modelithics
• Short — Revolutionary Self-Sensing Electric Artificial Muscles
• Flex007 Highlights
• Column — The Growth of Flex-hybrid Electronics in Mil-Aero Applications
• Short — A Foundation That Fits Just Right Gives Superconducting Nuckelates a Boost
• Top Ten Editor's Picks
• Career Opportunities section
• Educational Resources
• Advertiser Index and Masthead