88 SMT007 MAGAZINE I SEPTEMBER 2023
PDC 4: Reflow Profiling Simplified
Monday, October 9
1:30 p.m.–5 p.m. CDT
Instructor: Rob Rowland, Axiom Electronics
HPR2: Hardware Ruggedization for Extreme
Environments II
Monday, October 9
3:30–5:00 p.m. CDT
Chair: Sa'd Hamasha, Ph.D., Auburn University
"Electrical-plus Functional Testing is Instrumental
in Designing Electronics That Survive Harsh
Conditions"
Presenter: Mike Bixenman, MBA, DBA, Magnalytix,
LLC; Terry Munson, Foresite Labs
"Shear, Shock, Vibration and Thermo-cyclic
Mechanical Testing of Next Generation
Pb-Free Solder Pastes"
Presenter: Norman Armendariz, Ph.D., RTX
Raytheon
MD2
Monday, October 9
3:30–5:00 p.m. CDT
"The Importance of Having a Clean Slate in the
SMT Assembly Process for High-Density and
Fine-Pitch Applications"
Presenters: Charlie Fujikawa, Max Bernard,
Michelle Ogihara, Seika Machinery, Inc.
"Process Control of Rework Used in High
Reliability World"
Presenter: Rachel-Anne Stupp, Honeywell FM&T
"Recognizing the Root Cause
of Solder Joint Failures"
Presenter: Martine
Simard-Normandin, Ph.D.,
MuAnalysis Inc.
WLP: Speed Mentoring
and Round Table Discussions
Monday, October 9
4:00–5:00 p.m. CDT
Free for all attendees
Chairs: Jessica Molloy, ZESTRON Corporation;
Julie Silk, Keysight Technologies; Debbie Carboni,
KYZEN Corporation
The invited presentations will be followed by a
speed mentoring session where attendees rotate
through a selection of five tables hosted by SMTA
female chapter leaders and male allies on topics
related to personal branding.
WLP: Connection Reception
Monday, October 9
5:00–6:00 p.m. CDT
We will wrap up the Women's Leadership Pro-
gram with our annual Connection Reception. Join
us as we mingle and connect with fellow attendees!
More details coming soon. Wine and appetizers will
be served.
APT1: Package Assembly Process 1
Tuesday October 10
11:00 a.m.–12:30 p.m. CDT
"Wafer-to-Wafer (W2W) Hybrid Bonding—
The Next Generation of Advanced Packaging
Assembly"
Presenters: Ermily Duvall, Charles Woychik,
Chris Nichols, Skywater Technologies
"High-Density RDL Technologies for
Substrates and PLP"
Presenter: Lars Boettcher, Fraunhofer IZM
"Process Development to Achieve a High Yield
Wafer-to-Wafer (W2W) Hybrid Bond"
Presenters: Victor Vilar, Elan Herrera, Sangchae
Kim, Chris Nichols and Charles Woychik,
Skywater Technology, Inc.
