90 SMT007 MAGAZINE I SEPTEMBER 2023
PDC 5: Flex Circuit 'Design for
Manufacturing Principles' Circuit Design,
Fabrication and SMT Assembly Processing
Tuesday, October 10
1:30–5:00 p.m. CDT
Instructor: Vern Solberg, Solberg Technical
Consulting
PDC 6: Solder Joint Reliability—
Principle and Practice
Tuesday, October 10
1:30–5:00 p.m. CDT
Instructor: Jennie S. Hwang,
Ph.D., D.Sc.,
H-Technologies Group
PDC 7: How to Select a Solder Paste
for High Reliability and Yields
Tuesday October 10
1:30-5 p.m. CDT
Instructor: Ron Lasky, Ph.D., P.E., Indium
Corporation
MAT3
Tuesday, October 10
3:30-4:30 p.m. CDT
"Not All Things Are Created Equal: OSP and
Cleaning Chemistries"
Presenters: Frank Xu Ph.D., John Fudala, Michael
Orsini and Martin Bunce, MacDermid Alpha Elec-
tronic Solutions; Haley Reid, KYZEN Corporation
"Z-Axis Carbon Fiber-Indium Composite Thermal
Interface Material with Ultra-High Thermal
Conductivity for High Performance Computing"
Presenter: Rafael Padilla, Chunzhou Pan, Juan
Pino, Boston Materials Inc.
APT3: Package Materials
Tuesday, October 10
3:30-5 p.m. CDT
"Cu Conductive Paste as Via Filling Materials for
Various Substrates"
Presenters: Yoshinori Ejiri, Masumi Sakamoto,
Chiaki Shimizu, Resonac Co., Ltd.
"Performance Evaluation of Pure Indium Thermal
Interface Material (TIM) under Different Operating
Conditions in Single-Phase Immersion Cooling"
Presenter: Rohit Suthar, University of Texas at
Arlington
"Study of the FCBGA Package Interfaces Reliabil-
ity Under Monotonic and Fatigue Loads after Sus-
tained High Temperature"
Presenters: Pradeep Lall, Ph.D., Padmanava
Choudhury, Aathi Pandurangan, Madhu Kasturi,
Auburn University
WFD: Growing the Future Workforce
Tuesday, October 10
3:30-5 p.m. CDT
IRR3: Alloy Development and
Considerations for High Reliability
Tuesday, October 10
3:30-5:00 p.m. CDT
"Thermal Shock Testing of Third Generation
High-Reliability Solder Alloys from -40°C to 150°C"
Presenter: Jayse McLean, John Deere Electronics
Solutions
"Low-Voiding High-reliability Lead-free Solder
Paste for Automotive Applications"
Presenter: Jie Geng, Indium Corporation
"Effect of Bi-Addition on the High Strain Rate
Properties of SnAgCu Solders under Wide
Temperature Extremes and Prolonged Exposure
to High Temperature"
Presenter: Pradeep Lall, Ph.D., Vishal Mehta,
Mrinmoy Saha, Auburn University
"Intermetallic Compounds in Solder Alloys:
Common Misconceptions"
Presenter: David Hillman, Hillman Electronic
Assembly Solutions; Tim Pearson, Collins
Aerospace
APT4: Advanced Packaging
and Reliability
Wednesday, October 11
8:30-10:00 a.m. CDT
"Board Level Reliability Parametric Study for
Automotive FCBGA"
Presenters: Richard Lai, Nishant Lakhera, Sandeep
Shantaram, Varun Thukral, NXP Semiconductors
