SEPTEMBER 2023 I SMT007 MAGAZINE 91
"Si-Interposers for 3D Heterogeneous
Integration"
Charles Woychik, Ph.D., Chris Nichols,
Alan Huffman, SkyWater Technology;
John Allgair, BRIDG
TBD
Presenter: Andrew Mawer, NXP Semiconductors
LTS1: Thermal Cycling Performance of LTS
Sn-BI Solder Joints with and without Aging
Wednesday, October 11
8:30-10 a.m. CDT
Chair: Vasu Vasudevan, Dell Corp
Co-Chair: Mehdi Hamid, IBM
"The Thermal Cycling Performance of Hybrid
Low Temperature Solder Joints Tested at a
High Homologous Temperature"
Presenter: Richard Coyle, Ph.D., Nokia Bell Labs
"The Effect of Thermal Cycling Profile on Thermal
Fatigue Performance of an 84-Pin Thin Core BGA
with Hybrid, Homogeneous, and Resin Reinforced
Low Temperature Solder Interconnects"
Presenter: Dan Burkholder, Intel Corporation
"Reliability Performance Impacts of Isothermal
Aging on Homogenous Low Temperature
Solder Joints"
Presenters: Jason Stafford, Kevin Byrd, Jeffrey
Cook, Brian Franco, Intel Corporation
MFX1: Manufacturing Operations
Excellence
Wednesday, October 11
8:30-10 a.m. CDT
"Enabling Global SMT Line Efficiency Evaluation
through Advanced Data Analytics"
Presenter: Cameron Sobie, Ph.D., Arch Systems
"The Challenges and Common Pitfalls of Deploy-
ing Artificial Intelligence in Manufacturing"
Presenter: Audrey Chung, Darwin AI
"How Generative AI Can Be Used
in Electronics Manufacturing"
Presenter: Sheldon Fernandez,
Darwin AI
INS1: AI and Machine Learning:
Current Electronics Manufacturing
Inspection Applications
Wednesday, October 11
11 a.m.-12:30 p.m. CDT
Chair: Robert Boguski,
Datest Corporation
"Realtime Control 4.0:
How AI supports
Process Control"
Presenter: Ivan Aduna, Axel Lindloff, Koh Young
Technology
"Discover the AI Deployment in Verification
Tool for Inspection Equipment Towards
Smart Manufacturing"
Presenter: Piet Gek Tan, ViTrox
"Using Deep Learning to Help Automate Golden
Board Programming for Visual Inspection of
PCB Components"
Presenter: Francis Li, Mahmoud Famouri, Moham-
mad Javad Shafiee, Alexander Wong, Darwin AI
LTS2: Reliability Assessment of New
Low Temperature Sn-Bi Alloys
Wednesday, October 11
11 a.m.-12:30 p.m. CDT
Chair: Richard Coyle, Ph.D., Nokia Bell Labs
Co-Chair: Anna Lifton, MacDermid Alpha
Electronics Solutions
"Reliability Performance of a Fourth Generation
Low Temperature Solder Alloy in Homogeneous
and Hybrid Solder Joints, Part 2"
Presenter: Morgana Ribas, Ph.D., MacDermid
Alpha Electronics Solutions
"A Near Eutectic Sn-Bi based LTS with High
Thermal Fatigue Performance"
Presenters: Francis Mutuku, Hongwen Zhang,
Huaguang Wanb, Jie Geng, Indium Corporation
"Investigation of Compatibility and Reliability in
Low Temperature Soldering for Ball Grid Array
Components"
Presenters: Watson Tseng, Chunyu Chang, Coti
Chung, Keith Lee, Ken Lin, Shenmao America, Inc.
