SMT007 Magazine

SMT007-Sep2023

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92 SMT007 MAGAZINE I SEPTEMBER 2023 MFX2: Product Assembly Challenges Wednesday, October 11 11 a.m.-12:30 p.m. CDT "Fill the Void VI: A Study of the Impact of Solder Alloy on Voiding in Solder Joints" Presenter: Tony Lentz, FCT Assembly "Establishing Design Rules for the Laser Depaneling of Printed Circuit Boards" Presenters: Patrick Stockbruegger, M.Sc., Stephan Schmidt, LPKF Laser & Electronics North America "Modern Methods of PCB Depanelization and the Associated Considerations With a Focus on Low Impact Depanelization for Improved Reliability" Presenters: Max Bernard, Michelle Ogihara, Steven Yukutake, Yoshito Kanayama, Seika Machinery, Inc. PDC 10: ESD Concept to Reduce Electrostatic Charges in Manufacturing Processes—ESD Assessment Wednesday, October 11 1:30-5 p.m. CDT Instructor: Hartmut Berndt, Dipl.-Ing., B.E. STAT European ESD Competence Centre PDC 11: Failure Analysis of Electronic Devices Wednesday, October 11 1:30-5 p.m. CDT Instructor: Martine Simard-Normandin, Ph.D., MuAnalysis Inc. PDC 8: Selection Criteria of Surface Finishes for Better Reliability of Electronic Assemblies Wednesday, October 11 1:30-5 p.m. CDT Instructor: Kunal Shah, Lilotree PDC 9: Fan-Out, Chiplet, and Heterogenous Integration Packaging Wednesday, October 11 1:30-5 p.m. CDT Instructor: John H Lau, Unimicron Technology Corporation INS2: Advanced Imaging Applications— X-ray, SEM, Optical Microscopy—for Manufacturing and Failure Analysis Wednesday, October 11 2-3:30 p.m. CDT "Assessing Electronic Devices with Advanced 3D X-ray Microscopy Techniques and Electron Microscopy" Presenter: Herminso Villarraga-Gómez, ZEISS "In-Situ Thermal Radiographic Failure Analysis of Capacitor Encapsulant Fracturing" Presenter: Norman Armendariz, RTX Raytheon "A New X-ray Source Technology for Demanding SMT Inspection" Presenter: Keith Bryant, KB Consultancy LTS3: Effects of Elemental Additions to Sn-Bi Solder Alloys Wednesday, October 11 2-3:30 p.m. CDT Chair: Morgana Ribas, Ph.D., MacDermid Alpha Electronics Solutions Co-Chair: Francis Mutuku, Indium Corporation "A Path to Ductile Low Temperature Solders for Mass Production of Electronic Assemblies?" Presenters: Keith Sweatman, P.E., Xin Fu Tan, Qichao Hao, Stuart D. McDonald, Michael Bermingham, Kazuhiro Nogita, The University of Queensland; Qinfen Gu, ANSTO; Tetsuro Nishimura, Nihon Superior Co., Ltd. "The Effect of Sb and Ag Addition on the Melting, Undercooling, and Mechanical Behavior of Sn-Bi LTS" Presenters: Hannah Fowler, Yifan Wu, Purdue University

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