92 SMT007 MAGAZINE I SEPTEMBER 2023
MFX2: Product Assembly Challenges
Wednesday, October 11
11 a.m.-12:30 p.m. CDT
"Fill the Void VI: A Study of the
Impact of Solder Alloy on
Voiding in Solder Joints"
Presenter: Tony Lentz,
FCT Assembly
"Establishing Design Rules for the Laser
Depaneling of Printed Circuit Boards"
Presenters: Patrick Stockbruegger, M.Sc., Stephan
Schmidt, LPKF Laser & Electronics North America
"Modern Methods of PCB Depanelization and the
Associated Considerations With a Focus on Low
Impact Depanelization for Improved Reliability"
Presenters: Max Bernard, Michelle Ogihara, Steven
Yukutake, Yoshito Kanayama, Seika Machinery, Inc.
PDC 10: ESD Concept to Reduce
Electrostatic Charges in Manufacturing
Processes—ESD Assessment
Wednesday, October 11
1:30-5 p.m. CDT
Instructor: Hartmut Berndt, Dipl.-Ing., B.E. STAT
European ESD Competence Centre
PDC 11: Failure Analysis
of Electronic Devices
Wednesday, October 11
1:30-5 p.m. CDT
Instructor: Martine Simard-Normandin, Ph.D.,
MuAnalysis Inc.
PDC 8: Selection Criteria
of Surface Finishes for
Better Reliability of
Electronic Assemblies
Wednesday, October 11
1:30-5 p.m. CDT
Instructor: Kunal Shah, Lilotree
PDC 9: Fan-Out, Chiplet, and
Heterogenous Integration Packaging
Wednesday, October 11
1:30-5 p.m. CDT
Instructor: John H Lau, Unimicron Technology
Corporation
INS2: Advanced Imaging Applications—
X-ray, SEM, Optical Microscopy—for
Manufacturing and Failure Analysis
Wednesday, October 11
2-3:30 p.m. CDT
"Assessing Electronic Devices with Advanced
3D X-ray Microscopy Techniques and Electron
Microscopy"
Presenter: Herminso Villarraga-Gómez, ZEISS
"In-Situ Thermal Radiographic Failure Analysis of
Capacitor Encapsulant Fracturing"
Presenter: Norman Armendariz, RTX Raytheon
"A New X-ray Source Technology for Demanding
SMT Inspection"
Presenter: Keith Bryant, KB Consultancy
LTS3: Effects of Elemental Additions
to Sn-Bi Solder Alloys
Wednesday, October 11
2-3:30 p.m. CDT
Chair: Morgana Ribas, Ph.D., MacDermid Alpha
Electronics Solutions
Co-Chair: Francis Mutuku, Indium Corporation
"A Path to Ductile Low Temperature Solders for
Mass Production of Electronic Assemblies?"
Presenters: Keith Sweatman, P.E., Xin Fu Tan,
Qichao Hao, Stuart D. McDonald, Michael
Bermingham, Kazuhiro Nogita, The University
of Queensland; Qinfen Gu, ANSTO; Tetsuro
Nishimura, Nihon Superior Co., Ltd.
"The Effect of Sb and Ag Addition on the
Melting, Undercooling, and Mechanical
Behavior of Sn-Bi LTS"
Presenters: Hannah Fowler, Yifan Wu, Purdue
University
