SEPTEMBER 2023 I SMT007 MAGAZINE 93
"Microstructure Modification for SnBi Low
Temperature Solder Alloy"
Presenters: Albert Wu, National Central University;
Chao-Chin Chang, Tsao-Cheng Huang, Yu-Cheng
Chen, Formosa Plastics Corporation; Chang-Meng
Wang, Shenmao Technology Inc.
MFX3: Printing Challenges
Wednesday, October 11
2-3:30 p.m. CDT
"Vapor Deposited Stencil
Nano-Coatings—
A New Break Through or
Just Another Coating?"
Presenter: Greg Smith,
BlueRing Stencils
"An Exploratory Review of Variables Affecting
Solder Paste Volume and Reliability in the
Stencil Printing Process"
Presenter: Matthew Simeroth, ACC Electronix, Inc.
"Performance Comparison of Contemporary
Stencil Coatings and Under Wipe Solvents on
0.4 mm BGA Packages"
Presenters: Chrys Shea, Shea Engineering
Services; John Hanerhoff, Debbie Carboni,
KYZEN Corporation
INS3: Unique and Challenging
Test/Inspection Applications
Thursday, October 12
8:30-10 a.m. CDT
Chair: Keith Bryant, KB Consultancy
"Case Studies in the Evolution of FPGA
Counterfeiting"
Presenter: Jason Romano, Nicholas Williams,
SMT Corp
"The Trade-offs in Visual Quality Inspection
in a Mixed Assembly Environment"
Presenter: Andrew Hryniowski, Darwin AI
"Flying Probe Card Design
for Medical and Other
Challenging Applications:
a Case Study in Wafer Testing"
Presenter: Luca Fanelli, SPEA
LTS4: Electromigration, Shear and Drop
Shock Assessment of Low Temperature
Sn-Bi Solder Joints
Thursday, October 12
8:30-10 a.m. CDT
Chair: Rajen Sidhu, AMD
Co-Chair: Babak Arfaei, Juniper Network
"Comparison of Electromigration in Tin-Bismuth
Planar and Bottom-Terminated Component
Solder Joints"
Presenter: Prabjit Singh, IBM Corporation
"Low Temperature Solder Joint Shear Strength
of Components in SMT Assembly"
Presenters: Saurabh Gupta, Howlit Chng,
James M Wade, Kyle Davidson, Todd Smith,
Kevin J Byrd, Jose I Hernandez, Juan Landeros,
Intel Corporation
"Investigation into
Low Temperature
Solder Reliability"
Presenter: Michael Osterman,
Ph.D., University of
Maryland-CALCE-EPSC
MFX4: Interesting and Tangible Topics
Thursday, October 12
8:30-10:00 a.m. CDT
"Case Study: Analyzing 0402 Capacitor
Defects With Stencil Printing Misalignment
When Using Water Soluble and No-Clean
Solder Pastes, Part 2"
Presenter: Zachary Slater, *Martin Anselm, Ph.D.,
Rochester Institute of Technology
"Adiabatic and Isothermal Humidification for
Electronics Manufacturing: The Science of
Humidity Control in Manufacturing"
Presenter: Richard Williams, Carel USA
"Recent Advancements in Hot Bar Soldering"
Presenters: Ron Lasky, Ph.D., P.E., Dean Payne,
Chris Nash, Indium Corporation
