Issue link: https://iconnect007.uberflip.com/i/1506834
SEPTEMBER 2023 I SMT007 MAGAZINE 81 ing manufacturing. While not a technical deep dive into a specific technology segment, partic- ipants will leave with an understanding of the manufacturing processes and learn the impor- tance of communication in today's electronics manufacturing environment. Of course, none of this would have been pos- sible without the work of the SMTA Interna- tional Technical Advisory Committee (TAC.) e committee, comprised of distinguished electronics manufacturing and packaging industry experts, designed the conference pro- gram to ensure that today's latest trends and developments are fully addressed. We look forward to seeing you Oct. 9–12 in Minneapolis, Minnesota. More details and the complete technical program can be found on the conference website here. SMT007 • Dudi Amir, Intel Corporation • Colette Anctil, Collins Aerospace • Martin Anselm, Ph.D., Rochester Institute of Technology • Babak Arfaei, Ph.D., Juniper • Raiyo Aspandiar, Ph.D., Intel Corporation • Nilesh Badwe, Ph.D., Indian Institute of Technology, Kanpur • Jasbir Bath, Bath Consultancy • Andy Behr, Panasonic • Elizabeth Benedetto, HP Inc. • Mike Bixenman, DBA, MBA, KYZEN Corporation • Lars Boettcher, Fraunhofer IZM Berlin • Robert Boguski, Datest Corporation • Richard Brooks, Spartronics • Keith Bryant, KB Consultancy • Kevin Bryd, Intel Corporation • Bill Capen, Honeywell FM&T • Bill Cardoso, Ph.D., Creative Electron, Inc. • Burton Carpenter, NXP Semiconductors • Srinivas Chada, Ph.D., Project Kuiper-Amazon • Lenora Clark, MacDermid Alpha Electronics Solutions • Jean-Paul Clech, EPSI, Inc. • Marie Cole, IBM Corporation (retired) • William Cooper, John Deere Electronics Solutions Inc. • Eric Cotts, Ph.D., Binghamton University • Richard Coyle, Ph.D., Nokia Bell Labs • Priyanka Dobriyal, Ph.D., Intel Corporation • Michael Ford, Aegis Software • Trevor Galbraith, Global SMT & Packaging • James Elliott Fowler, Ph.D., Sandia National Laboratories • Jie Geng, Ph.D., Indium Corporation • Faramarz Hadian, Ph.D., Binghamton University • Sa'd Hamasha, Ph.D., Auburn University • Carol Handwerker, Ph.D., Purdue University • Md Hasnine, Ph.D., Qorvo, Inc. • David Hillman, Collins Aerospace (Retired) • Jason Keeping, Celestica, Inc. • Jeffrey Kennedy, ZESTRON Corporation • Robert Kinyanjui, Ph.D., John Deere Electronics Solutions Inc. • Richard Kraszewski, Plexus Corp. • Pradeep Lall, Ph.D., Auburn University • Dale Lee, Plexus Corp. • Tanya Martin, SMTA • Andrew Mawer, NXP Semiconductors • Tim Pearson, Collins Aerospace • Scott Priore, Cisco • Anto Raj, Medtronic • Chrys Shea, Shea Engineering Services • Rajen Sidhu, Ph.D., AMD • Julie Silk, Keysight Technologies • Gregory Vance, Rockwell Automation • Charles Woychik, Ph.D., Skywater Technologies We'd like to thank the following volunteers from the 2023 SMTAI TAC: Thank Y!