Issue link: https://iconnect007.uberflip.com/i/1514628
JANUARY 2024 I PCB007 MAGAZINE 65 together. We have all experienced hugely problematic supply chain issues. We hear the discussion about localizing manufacturing rather than globalizing manufacturing. We're all thinking this way now. Rather than trying to find competitive advantages, we saw that we need to stick together. Goodwin: Now, we all understand that there must be some thought to supply chain, not just technology because you can have the best tech- nology in the world, but if you can't deliver it at the right time, at the right price, in the right quantity and quality, it's meaningless. Morgan: Something to think about as well is that this is a young industry still matur- ing. It began in the 1950s— that's my lifetime. As our industry matures, what about advanced pack- aging and the demand on materials there? Morgan: Packaging is the big- gest growth area, and we see a lot coming together in packaging—electri- cal performance, thermal requirements, and more. Goodwin: Our technology direction is really driven by our IP, which is resin chemistry and coating technology; we see less glass fabric in the future. We will be coating films, copper, foils, and very thin products for buildup tech- nologies. Our expertise comes from working on our non-reinforced thermal dielectrics, but we are now applying this to low-loss materials. Morgan: We had a big discussion recently on this exact topic. We have a range of products and are now working on how we present them to the market. We want to make sure we tar- get this application, that we have the right nar- rative, and can clearly explain the benefits of using those. We will come back to join the sup- ply chain discussion because you can't have all the products in all the colors and all the sizes, so to speak. ere are many products in this space. We know that packaging is mostly made in Southeast Asia. We must move away from thinking this is just a Southeast Asian story. It isn't anymore. We've yet to see the impact of the CHIPS Act, but we need to be ready. We have been arguing strongly for the need to run this through the supply chain, and IPC has been working on this as well. ey plugged it into the EU just a few months ago to address our concerns to government. IPC's Alison James expertly led the group. We're talking a lot, raising the temperature for the politicians, and the money will flow. They are finally paying attention. Morgan: is is for both the U.S. and Europe. e money will flow eventually, so we have to make sure we use that money wisely and build into these advanced packaging technologies. What advice would you give a young designer? What questions should they ask you? Morgan: I would say to spend a bit of time with the material supplier, even a half-day early in your career, and ask, "How do I specify mate- rial for my design? What more should I con- sider? What's important? What's available?" Goodwin: Again, it's not just about the mate- rials anymore. It is about the supply chain as well. How can I get it? Where and when can I get it? Morgan: e most important question is prob- ably to go to any material supplier and say, "What are your best-selling products in this space?" e brochure is full of products and probably two-thirds can be eliminated once you know the story. It's not just about the materials anymore. It is about the supply chain as well.