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44 DESIGN007 MAGAZINE I FEBRUARY 2024 designers, and each targets different frequency ranges in PCBs, die, and packages. Discrete Embedded Capacitors Discrete capacitors are oen placed on pack- ages for some advanced processors. In addition to direct placement and assembly in a proces- sor package, these components can be embed- ded in a PCB or package substrate. It is possible to embed small capacitors in an organic substrate, including the organic mate- rials used to build PCB stackups and package substrates. Discrete capacitors placed in PCBs and substrates are off-the-shelf components, designated low-profile MLCCs. While not spe- cifically designed for embedding in substrates or PCBs, they can be embedded in these mate- rials thanks to their lower-than-normal profile. e target frequency range is 100 MHz to 1 GHz, or higher for specialty RF capacitors. Embedded Capacitance Material (ECM) is class of organic materials offers high capacitance density through the material's high dielectric constant. Noise/power fluctua- tions are damped at high frequencies because these materials are very lossy, having high loss tangents (~0.02 or higher) at lower frequencies than in PCBs/packaging materials. ey are very thin materials (~1-mil thickness) but they can be used in standard lamination and buildup processes with other materials for packaging and PCB stackups. ese materials are probably the simplest class of mater ials for providing low PDN impedance and damping power fluctuations simultaneously. ey can also help lower the overall PDN impedance curve over a broad frequency range. e target frequency range for embedded capacitance materials is ~1 MHz to 1 GHz. Embedded Dielectric Foils and Ceramics Other embedded capacitor materials are inorganic, and thus they cannot be used in a standard lamination process with other organic materials in PCBs and substrates. However, these can be used in two areas: • Capacitor dielectrics (non-ceramic) used in inorganic packaging and on-die Figure 1: A range of available embedded capacitors and their applications. Figure 2: These low-profile Murata MLCCs can be embedded.