Issue link: https://iconnect007.uberflip.com/i/1515637
54 DESIGN007 MAGAZINE I FEBRUARY 2024 Interview by Steve Williams FOR ASC Editor's note: is is the final installment in a three-part series. View Part 1 and Part 2. American Standard Circuits is an early adopter of Averatek's A-SAP ™ process for its ultra high density interconnect (UHDI) prod- ucts. In this final part of my interview with industry veteran John Johnson, vice president of business development at American Stan- dard Circuits, we use photos, slides, and mate- rials to discuss what he learned from his previ- ous role at Averatek. Steve Williams: John, let's talk about the design benefits of UHDI technology. John Johnson: It's really amazing what you can do with UDHI technology. ere are some things you have to watch out for in a design and because you can do the ultra-fine lines and spaces, a designer has a lot of things in their toolkit. You have via-in-pad plated over micro- vias, stacked and staggered microvias, and other different structures. But when designing with A-SAP, you first need to focus on using that ultra-fine line and then going to the other design aspects. Maybe use staggered microvias or several levels of staggered microvias and then use a stacked microvia if you really have to. at removes some reliability traps we've had to deal with because we couldn't reach those ultra-fine lines. Figure 1 shows what happens when you can achieve ultra-fine features with this technology. Current subtractive technology is around 75 UHDI FUNDAMENTALS: Talking UHDI With John Johnson, Part 3 Figure 1.