Design007 Magazine

Design007-Feb2024

Issue link: https://iconnect007.uberflip.com/i/1515637

Contents of this Issue

Navigation

Page 76 of 87

FEBRUARY 2024 I DESIGN007 MAGAZINE 77 I recently met with Laura Martin, director of applications engineer- ing for Summit Interconnect. Laura has been at Summit for about a year, moving into the role from a similar position at Insulectro. She has now become Summit's go-to design for manufacturing (DFM) expert, and she's working to move DFM further up in the design cycle, eliminating unpleasant surprises at CAM. I bet that title caught your attention. Has Korf finally lost his mind? The central theme of my I-Connect007 columns, as well as presenta- tions at PCB technical meetings, has focused on improving data package quality sent from designers to manufacturers. The goal is to transfer the design information to manufacturing and build the PCBs as-is. No semi-automated DFM, stackup generation, CAM editing, or data quality analysis should be needed. Altium has launched the BOM Portal within the Altium 365 plat- form. The BOM Portal is engineered to dramatically enhance collaboration between engineering and procurement teams, offering a unified approach to managing bills of materials (BOMs) in electronics design. The designer needs to have a working understanding of two key manufactur- ing operations: basic circuit board fabrication procedures and assembly process practices. For printed circuit board manufacturing, the number of steps required to produce the printed circuit board correlates to the circuit board's complexity. As technology advances, the demand for reliable PCBs with ever-increasing circuit density surges and highlights the pivotal role of fabrication in shaping the electronics landscape. In this intricate dance between innovation and execution, a symbiotic relationship emerges between designers and fab- ricators. This forms the core of success. The Advanced PCB Design Concepts course, 6:30 to 8:30 p.m. EDT March 18 to May 15, 2024, with virtual classes held on Mondays and Wednesdays, will start with the design of HDI and advanced packaging concepts. This will be fol- lowed by embedded component design and the students will see how concepts from HDI are used in the implementation of embedded components. For the latest news and information, visit PCBDesign007.com Altium Launches Altium 365 BOM Portal Dana on Data: Nuke the Netlist Save Your Design by Understanding Fab Processes IPC's Advanced PCB Design Concepts Training Course Designers Notebook: What Designers Need to Know About Manufacturing, Part 1 Beyond Blueprints: Early Involvement Shapes Superior Fab Outcomes

Articles in this issue

Links on this page

Archives of this issue

view archives of Design007 Magazine - Design007-Feb2024