Issue link: https://iconnect007.uberflip.com/i/1515637
FEBRUARY 2024 I DESIGN007 MAGAZINE 29 • Manufacturability and cost: Specialized equipment for embedding components can increase manufacturing costs. Shapes and voids may pose manufacturing chal- lenges, which must be considered in fabri- cation, assembly, and inspection. Complex manufacturing processes can lead to reli- ability issues if not executed precisely. As with any design decision, implement- ing embedded components in PCB designs involves cost tradeoffs. Knowing when to start embedding components and determining the price/technology cutoff requires careful con- sideration of various factors. e following are the key considerations for making informed decisions. • Application requirements: Evaluate whether the application demands a compact form factor, improved signal integrity, and/or enhanced thermal performance • Production volume: Consider the impact on cost tradeoffs based on production volume, with high-volume production making embedded components more economically viable • Component complexity and size: Assess the cost-effectiveness of embedding simple passive components versus surface mount (SMD) components and consider the size of components • Manufacturing capabilities: Ensure the chosen PCB manufacturer has the expertise and equipment for embedding components. Passive components require an additional material layer that's either subtractively etched or additively printed. Active components are oen in bare die form, and inserted mid-stream in the fabrication process. • Material costs: Carefully evaluate material costs and determine whether performance benefits justify additional expenses • Design iterations and prototyping: Account for prototyping expenses during initial stages of implementation • Technological maturity: Consider the maturity of embedded component tech- nology and assess the current state for potential advancements or cost reductions • Return on investment: Evaluate overall ROI to justify higher up-front costs with long-term gains While embedded component design poses challenges for some designers, modern EDA tools are generally equipped to handle this aspect of PCB design relatively easily. How this is addressed varies from tool to tool regarding features for defining shape, size, and placement as well as capabilities for simulation and analy- sis. Simulation and analysis must assess electri- cal and thermal performance considering the presence of embedded components. Utilizing 3D modeling allows visualization of the PCB layout in three dimensions, aiding in identifying interference and manufacturing issues related Figure 3: Example of intelligent cavity design object during layout.