Issue link: https://iconnect007.uberflip.com/i/1515990
16 PCB007 MAGAZINE I FEBRUARY 2024 on a particular subject where you have exper- tise. Since it is peer-reviewed, the data can be trusted, which is needed as a foundation for developing standards. Gumminger: We actually even spent several days as we built the conference agenda, com- paring the standards development committee meetings and conference schedules to miti- gate time conflicts on the same topics so that someone who is a leader in standards and very active in the conference could attend as many events as possible. LaRont: Does some of IPC's advocacy work, particularly around legislation in the U.S. and Europe, support more global participation in paper submissions? It's not just about Asia anymore with some of these technologies. Did that influence this process for the entire industry? Welzel: It is too early to tell if IPC advocacy has yet had an influence in this way. What we know is that we need more participation. For example, in the EV special session, as of today, we don't have a test coupon standardized for PCBs for high voltage-related testing require- ments. at is something we must work on. We are on the inside and at the forefront of technology. To accelerate innovation, we must harmonize requirements along the supply chain. If every stakeholder in the supply chain is working with different requirements, then there's much attrition and friction. It is when the requirements are clearly defined and stan- dardized across the supply chain that we can accelerate innovation. Matties: Automation and Factory of the Future are still popular topics. We're seeing investments in captive facilities with an increased focus on capability, and IPC has been involved in helping make that happen in the United States. Kelly: Yes, and we have seen quite a bit of inter- est from the U.S. Department of Defense. ey are very interested in these technologies. In the presidential determination in early 2023, IPC was instrumental in putting in language to include printed circuit board technologies and IC substrates. We don't have a lot of action behind it yet, but at least we have the aware- ness and the attention that these are impor- tant technologies. We are making sure they get included. Also, the design of printed circuit boards and how they are made is lacking from a reli- ability standpoint. As you know, whenever there is a change or standardization in EV markets or advanced packaging, commer- cially or for defense, the material sets called out in the design are at the ver y beginning of the process. As we continue working on the design side, we're also focusing on micro- via technologies and overcoming some of the reliability failure mechanisms. And as we get into these new devices and chipsets, those determine design aspects as well. IPC launched a new initiative in 2023 to bolster our PCB design support, working with Peter Tranitz, senior director of technology solu- tions. Matt Kelly