PCB007 Magazine

PCB007-Feb2024

Issue link: https://iconnect007.uberflip.com/i/1515990

Contents of this Issue

Navigation

Page 59 of 105

60 PCB007 MAGAZINE I FEBRUARY 2024 designing for harsh environments. We highlight just a few of the courses you can expect to see. Paul Cooke of Ventec Inter- national will address design and fabrication for high reli- ability. "Designing printed cir- cuit boards and assemblies is more difficult than ever due to complexity, component availability, thermal requirements, signal integrity, material selec- tion, layer counts, harsh environments, and increased functionality all required in smaller form factors," Cooke says. "We will look at all the elements to successfully design a PCB that can meet all the designers' requirements and perform to the customer and industry stan- dards as well as survive in today's harsh environ- ments. We will look at everything from materi- als to surface finishes and testing to ensure the product is robust as possible with a high level Feature Article by Julia Gumminger IPC e Professional Development Course pro- gram at IPC APEX EXPO 2024 will offer attendees a diversity of topics taught by new and returning instructors. Electronics indus- try professionals at any stage of their career will benefit. irty-two courses covering all aspects of the electronics manufacturing sup- ply chain will be offered on Sunday, April 7, and Monday, April 8. Participants in these courses will gain new knowledge and real-world skills that will equip them to rapidly respond to changing demands for new technologies, materials, and processes. Attendees will find updated content from vet- eran instructors and innovative courses from new instructors. e diversity of educational content includes courses about chiplets and heterogenous inte- gration, soldering, AI and machine learn- ing, design for manufacturing principles, and Professional Development: From AI to DFM

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-Feb2024