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66 PCB007 MAGAZINE I FEBRUARY 2024 Direct metallization systems based on con- ductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstand- ing. In today's highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treat- ment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space? The Carbon-based Systems (Graphite and Carbon Black) While both are carbon-based materials, graphite and carbon black have a few differ- ences. e graphite process is based on a very fine and stable aqueous dispersion of synthetic crystalline graphite. e graphite particle, by virtue of its crystalline structure, is highly con- ductive. Carbon black is an amorphous mate- rial with the ability to conduct current. Both materials are well represented in the global market for printed circuit board fabrication. So, what makes these two carbon-based pro- cesses ideal for thin material metallization and plated through-holes? Both processes are quite versatile in depos- iting carbon or graphite on non-conductive materials. is fact is especially important today as the industry's materials suppliers push the envelope to produce higher-performance resins and laminate composites. With each incremental enhancement in materials' prop- erties, such as coefficient of thermal expansion (CTE), temperature of decomposition (Td), signal integrity (SI), and glass transition tem- perature (Tg), these materials become more difficult to process. ese higher-performance materials are highly cross-linked and are more chemically resistant to processes such as alkaline perman- Supporting IC Substrates and Advanced Packaging, Part 5 Trouble in Your Tank by Michael Carano, IPC CONSULTANT