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70 PCB007 MAGAZINE I FEBRUARY 2024 e direct metallization process I've described will enable faster productivity through primary metallization in contrast with conventional electroless copper. PCB007 Michael Carano brings over 40 years of electronics industry experience with special exper- tise in manufacturing, perfor- mance chemicals, metals, semi- conductors, medical devices, and advanced packaging. To read past columns, click here. direct metallization systems are ideally suited for these challenges. e level of complexity is depicted in Figure 1. In addition, the ELIC process (every layer interconnect) is also practiced in the industry (Figure 2). With proper material selection, the construc- tions shown in Figures 1 and 2 will improve long-term reliability and withstand the mul- tiple laminations required. e key here is to select materials with low CTE and higher tem- peratures of decomposition. Figure 2: ELIC process.