Issue link: https://iconnect007.uberflip.com/i/1519075
22 PCB007 MAGAZINE I APRIL 2024 Feature Interview by Marcy LaRont I-CONNECT007 Tom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of tech- nology solutions, including mission systems, RF component and RF microwave micro- electronics assemblies, and quick turn and advanced technology printed circuit boards. In this interview, Tom discusses the deci- sion-making behind TTM's new ultra HDI PCB facility in Syracuse, New York, where the company already has a 160,000-square-foot RF microwave and microelectronics facility. He highlights TTM's commitment to innova- tion and meeting the dynamic demands of the industry, touches on the industry's need for supply chain resiliency and engagement with OEMs, and discusses what he finds most excit- ing about our industry right now. Marcy LaRont: On its face, it would seem like Syracuse naturally pops to the top of the list for your expansion. What criteria did you use in your selection? Tom Edman: We started with about 16 states as candidates, narrowed that down to 10 states for a more in-depth review, and then ended with two finalists. At the end of the day, it was TTM's High Tech Expansion and Industry Innovation