Issue link: https://iconnect007.uberflip.com/i/1519075
APRIL 2024 I PCB007 MAGAZINE 91 References 1. Happy's Tech Talk #27: Integrated Mesh Power System (IMPS) for PCBs, by Happy Holden, PCB007 Magazine, March 2024. 2. "A Comparison of Through Hole and Microvias in Printed Circuit Design," by R. Charbonneau, The Board Authority-HDI (I), Vol.1, No.2, June 1999, pp. 88-94. 3. "Predicting HDI Design Density," by Happy Holden and R. Charbonneau, The Board Authority- HDI (I), Vol.2, No.1, April 2000, pp. 28-31. 4. "A Statistical Approach to Wiring Require- ments," by G. Coors, P. Anderson, and L. Seward. Proceedings of the IEPS, 1990, pp. 774-783. Happy Holden has worked in printed circuit technol- ogy since 1970 with Hewlett- Packard, NanYa Westwood, Merix, Foxconn, and Gentex. He is currently a contributing technical editor with I-Con- nect007, and the author of Automation and Advanced Procedures in PCB Fabrication, and 24 Essential Skills for Engineers. To read past columns, click here. A recently tenured faculty member in MIT's departments of Mechanical Engineering and Materi- als Science and Engineering, Kim has made numer- ous discoveries about the nanostructure of materi- als and is funneling them directly into the advance- ment of next-generation electronics. His research aims to push electronics past the inherent limits of silicon—a material that has reli- ably powered transistors and most other electronic elements but is reaching a performance limit as more computing power is packed into ever smaller devices. Today, Kim and his students at MIT are explor- ing materials, devices, and systems that could take over where silicon leaves off. Kim is applying his insights to design next-generation devices, including low-power, high-performance tran- sistors and memory devices, arti- ficial intelligence chips, ultra-high- definition micro-LED displays, and flexible electronic "skin." Ultimately, he envisions such beyond-silicon devices could be built into super- computers small enough to fit in your pocket. The innovations that have come out of his research are recorded in more than 200 issued U.S. patents and 70 research papers—an exten- sive list that he and his students continue to grow. Kim credits many of his breakthroughs to the fun- damentals he learned in his university days. In fact, he has carried his college textbooks and notes with him with every move. Today, he keeps the under- graduate notes—written in a light and meticulous graphite and ink—on a shelf nearest to his MIT desk, close at hand. He references them in his own class lectures and presentations, and when brainstorm- ing research solutions. "These textbooks are all in my brain now," Kim says. "I've learned that if you completely under- stand the fundamentals, you can solve any prob- lem." (Source: MIT) Pushing Material Boundaries for Better Electronics