Issue link: https://iconnect007.uberflip.com/i/1519075
84 PCB007 MAGAZINE I APRIL 2024 A significant decrease in HDI substrate pro- duction cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia mul- tilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing opera- tions are eliminated. is Tech Talk describes the power mesh architecture (PMA), an innovative intercon- nection topology that leverages the produc- The Power Mesh Architecture for PCBs tion technologies of microvias, via-in-pads, and fine-line lithography to allow planar power distribution and dense signal interconnection on only four metal layers. e PMA was derived from the Intercon- nected Mesh Power System (IMPS), devel- oped and patented by the High-Density Elec- tronics Center (HiDEC) of the University of Arkansas, Fayettville, Arkansas. e IMPS topology was created to reduce the cost and metal layers on thin-film and ceramic mul- Happy's Tech Talk #28 by Happy Holden, I-CONNECT007 Figure 1: Power mesh was adapted from the IMPS architecture but does not route GND bussing.