SMT007 Magazine

SMT007-Sep2024

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36 SMT007 MAGAZINE I SEPTEMBER 2024 Feature Article by Josh Casper HORIZON SALES As electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant chal- lenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commer- cialization of this technology has been around since the early 2000s. So, why now? We've arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing. is has opened doors to new frontiers in the world of elec- tronics manufacturing. Here, we'll explore the rise of paste jetting technology: enhance- ments seen in recent years, unique use cases for this technology, and the business segments in which we are seeing the growth of this technology. Making Waves With Solder Paste Jetting

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