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28 SMT007 MAGAZINE I SEPTEMBER 2024 Feature Interview by Nolan Johnson I-CONNECT007 In this interview, Wolfgang Heinecke, head of global product management at Mycronic, discusses advancements and applications of jet printing technology, which offers solutions to the challenges faced by traditional stencil printing. He highlights the key benefits of jet printing, and explains the qualification process for solder paste compatibility as well as the soware-driven nature of jet printing, which allows for quick program creation and real- time adjustments. Nolan Johnson: Wolfgang, let's start with your background. Wolfgang Heinecke: I started at Siemens in 2000, working in product management and marketing before I moved to SIPLACE sales in France. I joined ASYS Group in 2013; I spent five years in Singapore, in charge of sales and service for ASYS in the rest of Asia, before joining Mycronic in 2018 in Germany as sales director for DACH. About 18 months ago, I joined Mycronic headquarters to lead product management. I have a team of five people, each one in charge of different product lines, includ- ing jet printing. Jet printing is a completely different approach. It avoids all the challenges of stencil printing. Nothing touches the PCB so there's no need for stencils. You don't need alignment between the stencil and PCB. You have the freedom to operate and to bring in the amount of solder paste you need in each place. e printing challenges are increasing. If you look, for example, into heavy EV boards, you'll find small chip components close to tall con- Mycronic's Jet Printer Technology