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38 SMT007 MAGAZINE I SEPTEMBER 2024 Enhancements in Solder Paste Jetting When looking at what has changed over recent years, several factors have contributed to the enhancements of solder paste jetting: Improved valve and nozzle technology Modern solder paste jetting systems have refined their nozzle and piezoelectric technol- ogies, allowing for finer control over the depo- sition process. Enhanced materials and refined actuator design allow for more precise control, leading to finer and more accurate paste depo- sition. Systems are now capable of consistently achieving deposition sizes down to 200 mm. Enhanced software Advances in soware have given the user more sophisticated control over jetting param- eters. ese enhancements optimize the jet- ting process in real time, adjusting for factors like viscosity and environmental conditions to ensure consistent paste placement. Height mapping features can account for PCB warp- age or even jetting on raised features or down into cavities. Increased speed and throughput While many will point out that solder paste jetting is not as fast as automated stencil print- ing, paste jetting systems have made signifi- cant leaps in recent years through both hard- ware and soware enhancements to drastically enhance throughput. Today's jetting systems can achieve speeds of 700K to 1 million dots per hour (DPH). Improved and varied paste formulations Advancements in solder paste formulations have also been a major factor in paving the way for new opportunities in the solder jetting realm. Modern solder paste formulations are designed with optimized viscosity to ensure they flow smoothly through jetting nozzles. is helps achieve consistent deposition with- out clogging or inconsistent flow. In addition, the use of finer solder particle sizes enables the production of smaller and more precise solder deposits. Unique Use Cases Many of you already understand that solder paste jetting excels in high-mix, low-volume environments. Unlike traditional stencil print- ing, which requires the creation of a custom stencil for each design iteration, solder paste jetting allows the user complete flexibility to adjust deposition parameters with the touch of a button. While I believe this is an impor- tant point to note, I've instead chosen to focus on some of solder paste jetting's lesser-known use cases. In this section, we'll explore unique applications and challenges well suited for sol- der paste jetting technology. PCB rework In repair scenarios, precision is paramount. As electronics continue to shrink and PCBs become ever denser, the popularity of sol- der paste jetting systems used in PCB rework has grown in recent years. Solder paste jet- ting allows for accurate deposition of solder exactly where it is needed, streamlining deli- cate rework on high-density PCBs without the risk of disturbing adjacent components. is Josh Casper