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64 SMT007 MAGAZINE I SEPTEMBER 2024 Acknowledgements e authors would like to acknowledge Larry Marcanti and the rest of the HDPUG staff for the guidance and coordination of the project through its many phases. Special rec- ognition to the those that provided laminate materials for the project and technical support through the project: Taiwan Union Technol- ogy Corporation (TUC), Elite Materials Cor- poration (EMC), AGC Multi Materials (AGC), and ITEQ. And an extended thanks to the PCB fabricators who supported the individual lot builds: WUS, Victory Giant (VGT), TTM- DMC, TTM-Forest Grove, AKM-Meadville, ACCL, SCC, Founder. SMT007 References 1. "Recent Advances and Trends in Advanced Packaging," by J.H. Lau, IEEE Transaction on Com- ponents, Packaging, and Manufacturing Tehcnol- ogy Vol.12, No.2, pp. 228-251, 2022. 2. "Impact of PCB Design, Materials, and Manu- facturing Process On PCB BGA Land Pattern Warp- age and SMT Yield," by Walwadkar S., et al, SMTAI Conference 2022. 3. "Study on the Effect of the Warpage of Elec- tronic Assemblies on Their Reliability," by O. Albrecht, K. Meier, H. Wohlrabe, IEEE 8th Electron- ics System-Integration Technology Conference (ESTC), Tønsberg, Norway, pp. 1-7, 2020. 4. "An Investigation into the Predictability of PCB Coplanarity for Romm vs. Lead-free Assembly Tem- peratures," by J.J. Davignon, IPC APEX EXPO Tech- nical Conference 2012. 5. "Warpage Studies of Printed Circuit Boards with Shadow Moire and Simulations," by S.J. Oon, K.S. Tan, T.Y. Tou, S.S. Yap, C.S. Lau, Y.T. Chin, 38th International Electronics Manufacturing Technology Conference 2018, Melaka, Malaysia. 6. "New Package/Board Materials Technology for Next-Generation Convergent Microsystems," by N. Kumbhat, Electronics Packaging Technology Conference 2003, pp. 331-335. 7. "Controlling Bow and Twist," by B. Willis, Elec- tronics Engineer, November 1997. 8. "Modeling Printed Circuit Board Curvature in Relation to Manufacturing Process Steps," by G.A. Schuerink, M. Slomp, W.W. Wits, R. Legtenberg, E. Kappel, 2nd CIRP Global Wed Conference 2013, pp. 55-60. 9. "Effect of Resin Content on PCB Warpage and Anti-Shock Performance of BGA Solder Joint," by M. Lili, 17th International Conference on Electronic Packaging Technology 2016, pp. 683-685. 10. "PCB Trace Impedance: Impact of Localized PCB Copper Density," by G. Brist, J. Krieger, D. Wil- lis, IPC APEX EXPO Technical Conference 2012. 11. "Development and Application of Novel Tech- nique for Characterising the Cure Shrinkage of Epoxy Resins," by R.F. Minty, J.L. Thomason, L. Yang, W. Stanley, A. Roy, Polymer Testing, Vol. 73, pp. 316-326. 12. "Characterization of Prepreg Shrinkage and Investigation of its Influence on Warpage Simu- lation," by J. Zundel, M. Sagerer, M. Frewein, T. Krivec, 22nd International Conference on Ther- mal, Mechanical, and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2021, St. Julian, Malta. 13. "Characterization and Modeling Cure- and Pressure-Dependent Thermo-Mechanical and Shrinkage Behavior of Fast Curing Epoxy Res- ins," by N. Lorenz, M. Muller-Pabel, J. Gerritzen, J. Muller, B. Groger, Polymer Testing Vol. 108, 2022. Neil Hubble is president of Akrometrix. Gary A. Brist is senior principal engineer of PCB technology and applications at Intel Corporation.