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84 SMT007 MAGAZINE I SEPTEMBER 2024 e solder joint temperature rise due to joule heating, that occurs under high electric current condition, must be determined for the electromigration rates to be useful in predict- ing the electromigration life of a solder alloy under application conditions. e coefficient of resistance approach is a convenient way of accurately determining the temperature rise of a solder joint due to joule heating. Electromigration research on solder joints such as BGA, BTC, C4, and others requires expensive fabrication resources and the micro- structural changes cannot be monitored dur- ing the electromigration test; whereas, the planar solder joints can be quite readily fabri- cated in a typical metallurgical laboratory, and the microstructural changes can be monitored on a real time basis under a microscope. e results of the two approaches have been found to be similar. SMT007 References 1. "Low temperature interconnects in 1st level packaging and its challenges," by C. Arvin et al., 2022 International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 2022. 2. "Binary alloy phase diagrams," by T Massalski, ASM, International, Materials Park, Ohio, 1986. 3. "The growth of dispersed precipitates in solutions," by G.W. Grenwood, Acta Metallurgica, Volume 4, Issue 3, May 1956, pp. 243-248. 4. "Microstructural coarsening and mechanical properties of eutectic Sn-58Bi solder joint during aging," by F. Wang., A. Luktuke, N. Chawla, Journal of Electronic Materials, (2021). 5. "Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints," by P. Singh, et al., The 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), May 2024. 6. "In-line test structure and non-destructive characterization of electromigration-driven phase evolution in microscale solder joints," by C. Jois, P-E Chou and G. Subbarayan, Journal of Electronic Materials, 2024. 7. "Reliability and Failure of Electronic Materials and Devices," by M. Ohring, Academic Press, 1998, page 191. 8. "Reliability and Failure of Electronic Materials and Devices," by M. Ohring, Academic Press, 1998, page 276. 9. "Tracer Study of Diffusion and Electromi- gration in Thin Tin Films," by P. Singh, Journal of Applied Physics, 1984. 10. "A novel setup for studing electromigration," by P. Singh, et al, Pan Pacific Microelectronics Symposium, Oahu, Hawaii, 2022. 11. "In Situ Study of Microstructureal Evolution During Electromigration in Eutectic Tin Bismuth Solder," by P. Singh et al, SMTA Pan Pacific Strategic Electronics Symposium, 2024. 12. "Electromigration in tin-bismuth planar solderjoints," by P. Singh et al., 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 2023. 13. "Comparison of electromigration in tin- bismuth planar and bottom terminated component solder joints," P. Singh, et al., SMTA International, Minneapolis, Minnesota, October 2023. Prabjit Singh works for IBM Corporation in Poughkeepsie, New York. Raiyo Aspandiar works for Intel Corporation in Hillsboro, Oregon. Haley Fu works for iNEMI in Shanghai, China. Lavanya Ashok Swaminathan works for Intel Corporation in Hillsboro, Oregon (no image available).