Design007 Magazine

Design007-Sep2024

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4 DESIGN007 MAGAZINE I SEPTEMBER 2024 FEATURE INTERVIEWS From Silicon to Systems with Matt Kelly, Devan Iyer, and Kris Moyer PCB Designers: 'Level Up' IC, Packaging Knowledge with Soo Lan Cheah Silicon to Systems: Collaboration Between IC and PCB Design Continues with Stephen Chavez Cross-domain Design: The Key to Managing Complex Methodologies with John Park Silicon to Systems: A Wake-up Call for the Industry with Duane Benson FEATURE COLUMNS Integrated Circuit to PCB Integration by Barry Olney Heterogeneous Integration and High-density System-in-Package Technologies by Vern Solberg 10 18 30 40 56 24 50 SEPTEMBER 2024 • FEATURE CONTENTS Silicon to Systems: From Soup to Nuts This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain. Will designers eventually be required to understand everything from semiconductors to system level and final assembly? 18 30 50 56 24

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