Design007 Magazine

HIGH RELIABILITY FORUM October 9–10, 2024 | McKimmon Center | Raleigh, NC Do you manufacture, design, or test electronics for mil-aero, automotive, and long-life applications subjected to harsh use environments? If so, don't miss the IPC High Reliability Forum. For more information visit: ipc.org/event/high-reliability-forum REGISTRATION is now OPEN EXHIBITORS & SPONSORS:

• Design007 Magazine — September 2024
• Feature Contents — Silicon to Systems
• Additional Contents
• Column — Silicon to Systems: From Soup to Nuts
• Short — Our Strength Comes From Working Together
• Feature Interview — From Silicon to Systems
• Feature Interview — PCB Designers: 'Level Up' IC, Packaging Knowledge
• Feature Column — Integrated Circuit to PCB Integration
• Short — The Impact of Parasitics on PCB Design
• Feature Q&A — Silicon to Systems: Collaboration Between IC and PCB Design Continues
• Short — Scientists Use Attosecond X-Ray Pulses to Shed New Light on Photoelectric Effect
• Column — Designing for Reality: Outer Layer Imaging
• Feature Q&A — Cross-domain Design: The Key to Managing Complex Methodologies
• Short — Scientists Demonstrate Potential of Electron Spin to Transmit Quantum Information
• MilAero007 Highlights
• Feature Column — Heterogeneous Integration and High-density SiP Technologies
• Feature Q&A — Silicon to Systems: A Wake-up Call for the Industry
• Column — Revisiting 'The Calf Path'
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index and Masthead
• Problems Solved — Subscribe to Our Magazines