Issue link: https://iconnect007.uberflip.com/i/1527276
OCTOBER 2024 I SMT007 MAGAZINE 51 Prevention • Supplier verification: Conduct thorough background checks on suppliers, verifying certifications and conducting audits. • Implementation of standards: Adopt industry standards such as SAE AS5553 and AS6171 for guidelines on detecting and preventing counterfeit parts. • Anti-counterfeit technologies: Employ digital watermarking, holographic labels, blockchain, and RFID tags to enhance product authentication and traceability. Mitigation • Risk-based approach: Implement a risk- based approach to identify and prioritize high-risk components and suppliers. • Quarantine procedures: Immediately quarantine suspect components upon detection, marking them as nonconforming. • Supplier notification: Promptly inform suppliers and procurement representatives of any suspect parts. Identification (Detection Methods) • Certificate of compliance: Verify the authenticity of certificates and documents provided with components. • Visual inspection: Examine components and packaging for signs of counterfeiting, such as incorrect logos, misspellings, and improper date codes. • X-ray fluorescence (XRF): Non-destruc- tive technique for testing elemental com- position of electronic components. • Advanced testing methods: Utilize X-ray inspection, C-Mode scanning acoustic microscopy (CSAM), and decapsulation to analyze internal structures and materials. • Advanced spectroscopy techniques: ese are particularly effective for detect- ing sophisticated counterfeits, such as those that could be produced by SOEs. • Destructive physical analysis (DPA): Dis- assemble, test, and inspect components to verify design, materials, construction, and workmanship. • Scanning electron microscopy (SEM): Produce high-resolution images of a sam- ple's surface, revealing detailed topo- graphic features, and when combined with Energy Dispersive Spectroscopy (EDS), SEMs can provide qualitative and quanti- tative elemental analysis of the test samples. • Functional testing: Perform functional testing to verify that components meet performance specifications. is can help identify counterfeits that mimic function- ality but fail under specific conditions. • Quality conformance inspection (QCI): is more comprehensive testing includes complete electrical tests over tempera- tures, post-burn-in full electrical tests over temperatures, and lot acceptance testing. • Fourier Transform Infrared Spectroscopy (FTIR): FTIR is used to identify the chemical structure of a device's materials. By comparing the infrared spectrum of a suspect component to known good data, FTIR can reveal discrepancies in encapsu- late materials or coatings, helping to iden- tify cloned or counterfeit parts. • Cybord AI: Cybord AI is a cutting-edge solution designed to combat counterfeit electronic components. is technology leverages advanced AI algorithms to ana- lyze electronic components in real-time during the assembly process, offering a more efficient and cost-effective alterna- tive to traditional lab testing. Cybord AI goes beyond mere detection; it also pro- vides manufacturers with a verifiable record of meticulous component checks. is capability can potentially save compa- nies from the crippling costs associated with product recalls in cases of field failures.