SMT007 Magazine

SMT007-Apr2025

Issue link: https://iconnect007.uberflip.com/i/1533904

Contents of this Issue

Navigation

Page 20 of 95

indium.com ©2025 Indium Corporation Excellent drop shock reliability in low-temp applications and TCT 15% * energy savings Reflow temperature 200–240°C *Dependent on process Enhanced thermal cycling performance Superior voiding performance Reflow temperature 235–250°C High transfer efficiency and exceptional SPI yield High oxidation resistance to eliminate graping in air reflow Low BGA, CSP, LGA, and QFN voiding Indium12.9HF OF NEXT SOLDER EVOLUTION THE

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT007-Apr2025