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72 SMT007 MAGAZINE I APRIL 2025 Knocking Down the Bone Pile by Nash Bell, BEST, INC. Basics of Component Lead Tinning e component lead tinning process serves several critical functions, including remov- ing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead- free for RoHS compliance. We will cover each of these topics in more detail in upcom- ing columns. Traditionally, some in the electronics assembly industry have utilized a single static solder pot for manual lead tinning. While typically performed as a secondary opera- tion prior to board assembly, this may appear to be economical but has several disadvan- tages from a quality standpoint. e use of a single static solder pot for both removal of an original alloy as well as com- ponent re-tinning should be avoided. is is not a recommended practice since dross, organic contaminants, flux residue buildup, and accumulation of gold can be trans- ferred to the re-tinned component leads or terminations. ose using this practice rely on outdated standards and procedures that are not in compliance with the GEIA- STD-0006 component re-tinning industr y requirements. A manual re-tinning process typically involves a technician dipping a through-hole or surface mount device multiple times into a static solder pot to remove the original lead