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APRIL 2025 I SMT007 MAGAZINE 29 With miniaturization and ultra-high-density interconnects (UHDI) becoming more com- mon, how is X-ray technology evolving to keep up with these challenges? Lykke: ere are several ways to approach this, or even a combination of methods. One option is using higher-resolution X-ray tech- nology, now capable of sub-1 micron focus spots, which generally improves the detec- tion of smaller objects and defects. Addition- ally, AI plays a crucial role here for the same reasons mentioned earlier, enhancing detec- tion accuracy with minimal effort. Product design also impacts inspection results. Ideally, designing the product with- out heavy metal objects directly opposite fine- pitch components can improve visibility. How- ever, this is rarely feasible since boards are typ- ically designed with specific requirements in mind. In challenging cases, achieving sufficient visibility may require higher tube power, which can risk washing out fine defects. What are the most common misconceptions about X-ray inspection in electronics man- ufacturing, and how do you address them when working with customers? Lykke: Misconception: X-ray can detect every defect perfectly. Reality: While X-ray is highly effective, it's not foolproof. Certain defects, especially those involving subtle material inconsistencies or minimal density differences, can be challeng- ing to detect. AI-enhanced image processing significantly improves detection rates but is still dependent on image quality and inspec- tion parameters. Misconception: Higher tube power always means better results. Reality: Increasing tube power may improve penetration but can also wash out fine details as mentioned above, particularly in delicate components or small solder joints. Proper calibration and balancing resolution with power are critical. Misconception: More images always mean better inspection. Reality: Capturing excessive images can improve detail but may drastically slow the process. e key is finding the right balance between resolution, speed, and data volume, especially for inline inspection. Misconception: X-ray inspection is only for complex boards. Reality: While essential for complex PCBs with hidden joints (e.g., BGA, QFN), X-ray can also improve quality control on simpler boards by detecting solder voids, bridges, or alignment issues. Misconception: X-ray inspection is too slow for inline production. Reality: Modern inline X-ray systems are designed for high-speed inspection, especially with AI algorithms that reduce processing time by quickly identifying areas of concern. Misconception: All X-ray systems provide the same results. Reality: Different X-ray technologies, 2D, 3D, and CT vary in detail, speed, and suit- ability for certain applications as described above. Choosing the right method is crucial for achieving optimal results.