Issue link: https://iconnect007.uberflip.com/i/1533904
38 SMT007 MAGAZINE I APRIL 2025 While historically X-ray inspection was not the preferred technology, advances in image resolution and speed have made it the unique solution for inspecting 3D packaging non- destructively today. Advanced packaging companies seek non- destructive automated inspection tools that are fast enough to provide value within their production processes, increase yield, and reduce waste at an early stage. is arti- cle will give an overview on how X-ray and laminography inspection can provide value- added data and information within minutes instead of weeks, for exactly that. Figure 1: Example of a 3D package with various interconnects. Figure 2: Slice and 3D rendering of GPU with 0.85 µm voxel.