Issue link: https://iconnect007.uberflip.com/i/1533904
60 SMT007 MAGAZINE I APRIL 2025 tooling, AM is helping to reduce costs and improve efficiency. Here, we'll explore AM's impact on electronics manufacturing, from the improvements that have made it a viable solution to some of the real-world applica- tions existing today. Advanced Materials for Higher Tempera- tures, Strength, and ESD Protection One of the recent developments of addi- tive manufacturing is the improvement in materials, allowing AM to meet the spe- cific demands of the industry. As electron- ics manufacturing involves exposure to high temperatures, particularly during processes like wave soldering and reflow, AM materials have evolved to withstand these conditions. Materials such as high-temperature-resis- tant carbon fiber PEEK (PolyEtherEtherKe- tone) enable the production of parts that can endure the heat generated during processes like wave soldering. ese materials retain their integrity even at temperatures exceed- ing 250°C, making them ideal for applications where traditional AM plastics might fail. In addition to temperature resistance, the strength of additive manufacturing materi- als has significantly improved in recent years. Today, manufacturers have access to mate- rials with enhanced strength and durabil- ity. is is particularly important in applica- tions where support tooling needs to remain rigid and flat to hold products in place with- out the risk of warping. Materials like carbon fiber polymers offer significantly enhanced strength, allowing the production of parts that are both lightweight and capable of han- dling the forces encountered during produc- tion processes. Additionally, with the importance of ESD protection in electronics, additive manu- facturing has advanced to include materi- als with integrated conductive or dissipa- tive properties. AM companies can produce parts that prevent electrostatic buildup and discharge, reducing the risk of damage to sensitive components. ese materials can safely be used in applications ranging from JEDEC trays to wave solder pallets, ensur- ing that all parts remain safe during manu- facturing and transport. Additive Manufacturing and Wave Solder Pallets Wave solder pallets are typically manufac- tured utilizing traditional subtractive manu- facturing approaches, such as milling, drill- ing, cutting, etc. is involves the removal of material from a solid block to achieve the desired form. While capable of high preci- sion, these methods can be time-consuming and expensive, particularly when producing intricate parts. ese small inefficiencies can create a bottleneck in PCB manufacturing. Additive manufacturing addresses these limitations by enabling the production of highly customized wave solder pallets. Man- ufacturers can use design and print pallets tailored to the unique dimensions of the PCB and the components being assembled. is not only provides greater flexibility in production but also allows for quicker turn- around times. Manufacturers can easily iter- ate and adjust the design of their solder pal- lets digitally. Josh Casper